Envio em 1 dias para itens em estoqueGarantia mínima de 3 anosSuporte especializado gratuito de engenheiros licenciadosDescontos por volumeNet 30 para empresas
ConfigurarConfigurar um sistema
PT
EnglishFrançaisEspañolDeutschItalianoPortuguêsNederlandsSvenska日本語한국어简体中文
Orçamento
Início / Case studies / Repeated wafer features in SWIR
Application study · Semiconductor processing

Wafer patterns: compare940 and1550 nm before choosing the inspection band

The real source labels this a wafer inside-hole inspection. Its1550 nm capture separates the repeated central features more clearly from a bright background than the940 nm capture.

Validate the sample material before generalizing a spectral result.

  • Proposed light housing (spec)117 × 117 × 23 mm
  • EvidenceReal application-lab captures
  • Camera (proposed)1280 × 1024 InGaAs
  • Scene field100 × 80 mm scene framing only; illustrative, not a printed lens field
3D view of the inspection set-up: camera, lens, light and partDrag to rotate · scroll to zoom
3D illustration · real CAD where available
Walk through this setup 5 guided stops
From component to inspection

Understand each choice.

Choose a stop to frame the part in 3D and see why it belongs in this setup. The component notes and links remain available if 3D cannot load.

Camera and available lens CAD are published models. Light envelopes and the station base/height use printed dimensions. Part shapes, brackets, holders, shielding and spacing are illustrative; they are not reconstructions of a source part or a complete mechanically validated assembly. Light paths explain the proposed arrangement and do not simulate optical performance. The SWIR scene field is illustrative; no measured field or printed magnification/working-distance relationship is asserted. Purple is a display convention for invisible illumination.

From the demo to your test bench

Build around the parts you can buy.

Explore each component, check its specifications and compare alternatives. The proposed quote includes the linked test station; its catalog listing includes two lighting holders.

Mount the optics with intent

The station is an optical test bench, with its two lighting holders included in the catalog listing. The 3D column and base follow the published height and footprint. Carriages, clamps and part supports are schematic: confirm camera screw pattern, lens support, light fasteners, permissible load and actual travel before ordering.

Configure the mounting station →

Complete the electrical system

Select a controller against the exact light voltage, drive mode and power, then confirm camera data/power/I/O cables and a suitable PC. These are not silently added to the proposed optical kit.

Lighting application-lab image sheet

Evidence you can inspect

Visible in the images

The1550 nm capture has stronger visible separation of the repeated central features.

What the source reports

The source identifies the wafer inside-hole application and the940/1550 nm bands; no material thickness, field, feature size or camera model is given.

How to use this evidence

An application-lab lighting demonstration, not a customer deployment or a qualified production inspection. Proposed camera, lens, fixture and scene spacing require a fresh trial. Source observations do not establish a defect-size limit, accuracy guarantee or production false-call rate.

What the camera saw

Cropped from the source test sheet; original test annotations are retained. Captures are not generated or enhanced. Drag the comparison slider or use the image buttons.

Source940 nm capture of the repeated wafer pattern.Source1550 nm capture: repeated central dark features stand out in the bright regions.NIR940 nmSWIR1550 nm
NIR940 nm: Source940 nm capture of the repeated wafer pattern.
SWIR1550 nm: Source1550 nm capture: repeated central dark features stand out in the bright regions.
Wafer workpiece shown in the source sheet.
Wafer workpiece shown in the source sheet.

The challenge

A surface view can obscure features associated with a wafer structure. Transmission and reflection change with material, thickness and wavelength, so the chosen band needs a real sample trial.

How it was solved

The source compares NIR940 nm with SWIR1550 nm, without naming a complete camera, lens or light model. The proposed1550 nm panel and SWIR camera/lens are a transmission-trial concept.

The actual wafer material, thickness and original illumination geometry are not supplied. The proposed panel arrangement is not a reproduction of the tested system.

Why it works

  1. 1

    A change in relative transmission or reflection can make a repeated feature pattern easier to distinguish.

  2. 2

    The image does not establish the physical size or depth of the central features, wafer composition or a verified internal-defect classification.

From image contrast to a production decision

What to validate on your part

A useful sample image is the starting point. These are the checks that turn the concept into a defensible inspection.

  1. 01

    Verify the material stack

    Use the actual wafer material, thickness, coatings and required feature before assuming infrared transmission.

  2. 02

    Confirm the light arrangement

    Trial the proposed panel transmission geometry and compare reflection if the sample requires it.

  3. 03

    Validate feature decisions

    Use independently confirmed good and defective samples and calibrated scale before defining detection or measurement limits.

Explore your inspection requirements

How many pixels cover your feature?

Compare feature coverage, camera pixel requirements and exposure using your own planning inputs. These are calculated planning values, not inspection results or an accuracy specification.

Editable planning scenario. Adjust these example inputs for your application; they are separate from the source test and 3D setup. Motion allowance and target coverage are starting points to validate, not acceptance limits. Pixel count starts from the proposed camera's catalog resolution.

Object sampling0.07812 mm/px
Pixels across feature6.4 px
Horizontal pixels for target1000 px
Motion during exposure0.128 px
Exposure ceiling from motion390.6 µs
Formulas and assumptions

The field, feature, speed and exposure start with neutral example values. They are not taken from the source test or the 3D illustration. Allowed motion starts at an editable 0.5-pixel example; it is not a recommended acceptance limit. Target coverage starts at an editable 5-pixel example; it is not a recommended detection or measurement threshold. The horizontal pixel count starts from the catalog Resolution row for MV-CI013-GS-NN. Use the effective width after cropping, binning or decimation if those modes are enabled.

  • Object sampling (mm/px) = field width (mm) / horizontal pixels.
  • Pixels across feature = feature width (mm) / object sampling (mm/px).
  • Horizontal pixels for target = field width (mm) × target pixels across feature / feature width (mm), rounded up to a whole pixel.
  • Motion (px) = speed (mm/s) × exposure (µs) / 1,000,000 / object sampling (mm/px).
  • Exposure for allowed motion (µs) = allowed motion (px) × object sampling (mm/px) / speed (mm/s) × 1,000,000.

The exposure result is the maximum duration from this motion allowance alone. At zero speed, motion sets no exposure limit; the camera, lighting, saturation and other constraints still apply. A shorter exposure does not itself guarantee a reliable inspection.

Field width and feature width refer to the same object plane. The motion calculation assumes uniform linear motion parallel to the field-width direction and a single exposure. It does not model perspective, vibration, rolling-shutter distortion, diffraction, defocus or optical distortion. A strobe may change the effective exposure.

The target result is a horizontal sampling requirement, not a camera recommendation or a change to the selected camera. It uses the effective image width after cropping, binning or decimation and does not determine the vertical resolution or sensor size. Pixel coverage alone does not establish detectability or measurement accuracy. Validate contrast, lens performance, working distance, illumination, calibration, camera exposure limits and the inspection algorithm on representative parts. Changing field width does not change the 3D model or certify that the proposed lens can achieve that field.

The set-up and the parts

Source cameraNot identified in the source sheet
Camera and lensProposed catalog components
Scene field100 × 80 mm scene framing only; illustrative, not a printed lens field
Lens-to-part in proposed scene400 mm; illustrative spacing above printed minimum object distance
Mounting (proposed)LS-BT-XZ-G-8-6045 · catalog test station with two lighting holders
Configure the standard components

Custom configuration requirements stay attached to this quote. The configurator starts with the standard parts; confirm the custom lights with your quote.

"Tested" identifies the part named in the source. "Our pick" is a proposed alternative or supporting part. The quote includes only cards marked "In proposed setup", with the quantities shown; other test arrangements are separate. Confirm colour, optics, controllers, power supplies, cables and mounting before ordering.

About this case study: the photos and camera images come from the application laboratory of the maker of the lighting and optics we sell, imaged on the parts shown; your results depend on your part, camera and set-up. This is an application-lab study, not a LumaSpec customer deployment. Source figures are reported results; proposed components require a fresh trial. The 3D scene illustrates the arrangement and does not simulate imaging performance.

More case studies

Start with your inspection requirement

Make the next trial specific.

Tell us the part size, smallest defect or tolerance, available working distance, material and line speed. Include what a good part and a reject look like.

Discuss your applicationConfigurar um sistema